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N. N-dimethylbenzylamine (BDMA)

inoa kemika:N.N-dimethylbenzylamine (BDMA)
Huina mole: C9H13N
Helu CAS: 103-83-3
Kaumaha molekula: 135.21
helehelena: Wai waihoʻoluʻu ʻole a melemele
Maʻiʻo: ≥99%
Solubility: hiki ke hoʻoheheʻe ʻia i ka ethanol, etera, hiki ʻole ke hoʻoheheʻe ʻia i ka wai
Ka pae paila: 180--182 ℃
Hōʻike hoʻohālikelike: 1.4985-1.5005
Kaumaha kiko: ʻeʻe ʻewalu ʻeiwa ʻehā
[puke a me ka waiho ʻana] 180kg pahu hao

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ʻElua methyl benzamine (BDMA) ʻelua methyl benzamine (BDMA) he mea hoʻoheheʻe no ka polyester polyurethane bulk soft foam, polyurethane fridge rigid foam, polyurethane sheets a me nā uhi hoʻopili i ka ʻoihana polyurethane.Hoʻohana nui ʻia ia i ka ʻōpala paʻa, hiki ke hana i ka polyurethane foam i loaʻa ka maikaʻi ma mua o ka wai a me nā ʻūhā like ʻole, a ʻoi aku ka ikaika o ka hoʻopaʻa ʻana i ka pahu a me ka substrate.Ma ke kahua o ka organic synthesis, BDMA ua nui hoʻohana 'ia e like me catalyst, corrosion inhibitor, ka waikona neutralizer, accelerator no electron microscope slice embedding i loko o ka synthesis o ka dehydrohydrohalide i ka lāʻau olaola, a me ka quaternary ammonium paʻakai a me ka cationic ili ikaika bactericide ikaika;ʻO BDMA i loko o ka epoxy resin, i hoʻohana nui ʻia e hoʻolaha i ka anhydride, polyamide, aliphatic amine curing system, accelerate product curing, hoʻohana nui ʻia i ka epoxy resin electronic potting material, encapsulation material, epoxy floor coatings, ka pena moana e like me ka curing accelerator.


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